华南理工大学研究生课题：硅通孔(TSV) 结构三维系统封装(SiP) 的热-力可靠性分析;
广东省大学生创新实验项目：多孔磁性形状记忆合金的创新制备及其显微组织研究;
华南理工大学本科生研究项目：AZ91镁合金表面稀土复合化学钝化膜制备工艺优化与表征;
The Interfacial Thermo-Mechanical Reliability of 3D Memory-Chip Stacking with through Silicon via Array, The 16th International Conference on Electronic Packaging Technology (ICEPT 2015): 2015.08 EI，一作;
Influence of Geometry of Micro-Bump Interconnection Thermal Stress and Fatigue Life of Interconnects in Copper Filled through Silicon via Structure, The 14th International Conference on Electronic Packaging Technology (ICEPT 2013) 2013.08 EI，二作;
《TSV结构微凸点互连热疲劳寿命的研究》，2013中国力学大会，二作;
